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High-Performance Computing (HPC) Cooling

As demand for high throughput in artificial intelligence and high-performance computing increases, so does the need for effective cooling systems. Modern processors and other active components generate high degrees of heat, and traditional air cooling methods can no longer keep operating temperatures sufficiently low.

Due to the higher specific heat and heat transfer coefficients, the use of liquid coolants offers precise server rack temperature regulation, increased design flexibility and reduced power consumption. Microchannel liquid cooling can transfer heat more effectively by an order of magnitude over traditional liquid cooling approach.

At Mikros Technologies, we provide microchannel cold plates designed to cool components effectively with the lowest thermal resistance and pressure drop available.

New M1

High-Performance Computing Cooling Applications

Our microchannel cooling solutions can effectively manage a wide variety of high heat flux applications, from high-density storage to computationally heavy AI workloads. System designers can use microchannel cooling for high-performance computing systems such as:


Data centers and enterprises can use Mikros cold plates for liquid-cooled server racks that regulate component temperatures while decreasing noise and reducing power consumption. The low thermal resistance of our microchannel matrices allow Mikros cold plates to absorb greater power usage spikes, preventing data loss and damage to expensive hardware.


Mikros Technologies designs microchannel cold plates to cool central processing units as well. Low thermal resistance and pressure drop allows the cold plate to transfer power from the source to the coolant with minimal system impact.


By dissipating heat evenly and effectively over larger areas, our cold plates allow graphics processing units to computer faster without overheating.  Temperatures can be regulated reliably over multiples processing zones.

Artificial Intelligence

Challenging artificial intelligence workloads need higher-wattage processors. Enterprises can use our microchannel cooling plates for systems that perform tasks like machine learning, deep learning and high-frequency training.

Wafer Scale Computing

Wafer scale integration involves building a large integrated circuit network on a single wafer, creating a chip ideal for AI applications. The thermal performance of Mikros’ microchannel cooling designs are not limited by size. We are thus well-suited to address the high heat flux cooling needs of powerful chips with very large form factors.

Temperature Balancing

Our microchannel cold plates can reduce temperature gradients by distributing coolant evenly across an active heated surface, over multiple zones and levels. By directing larger flows to areas that need more cooling capacity, the plates tailor local thermal resistance to combat hot spots, reduce temperature gradients and lower total coolant flow requirements.

Multi-Chip Packaging

In multi-chip packaging, multiple integrated circuits or semiconductor dies are integrated into a single module, increasing packaging efficiency.

Dual-Die and Multi-Die

Our liquid cooling plates can accommodate dual-die and multi-die packages.

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Benefits of Microchannel Cooling for High-Performance Computing

High-Performance Computing Efficiency

High fluid exit temperatures facilitate better heat rejection and better computing efficiency. Our computer rack liquid cooling technology can dissipate over 1kW/cm2 while keeping surface temperature rise to a minimum.

Larger Thermal Capacities

Greater heat dissipation allows our microchannel cooling systems to absorb larger temperature spikes, protecting HPC hardware from damage. High heat dissipation at low flow rates and low-pressure drop allows for smaller pumping components and a lower overall cost of ownership.

Increased System Reliability

Our thermal management solutions can significantly lower junction temperatures, the semiconductor’s highest operating temperature. This capability helps extend the lifespan and reliability of key components, ensuring they function reliably and reducing the time and cost of replacing failed components.

Learn More About Liquid Cooling in High-Performance Computing

Our knowledgeable team is ready to help you with your next thermal management application. To find out if our microchannel cooling options could meet your HPC system needs, reach out to us today.