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Thermal Calculator

Do the Math


Leading technology companies “do the math” because, when physics translates into electricity costs and productivity risks, thermal management becomes a business-critical decision. Data-driven insights support smarter choices in materials, components, and cooling strategies—saving time and cost while enhancing design robustness. In high-performance applications, thermal modeling tools are essential for quantifying heat loads, assessing cooling needs, and predicting temperature behavior under various conditions. Accurate thermal modeling helps system components avoid overheating, ensure reliability, and optimize system efficiency.  

At Mikros Technologies, our approach starts with initial scoping calculations that prioritize accuracy and incorporate built-in conservatism to ensure thermal performance targets are met or exceeded. One of the most influential variables in thermal performance is the thermal interface material (TIM). Minimizing TIM bond line thickness is critical for reducing thermal resistance; however, this is often constrained by factors outside cold plate design—primarily the curvature or out-of-flatness of the package or die being cooled. To address this, we apply conservative TIM resistance values based on typical experience with die warpage and curvature, ensuring realistic and reliable estimates.

You can use our calculator below as a starting point for your assessment. For a customized scoping calculation tailored to your specific design and constraints, please complete our Contact Us form.

Connect with Our Team for Tailored Scoping Calculations

Add Inputs for Your Project

Thermal Design Inputs

Active AreaLength and Width measurements of area that requires cooling, in millimeters (mm)

0

500

0

500

0

5000

Additional Factors

Water and Water-Glycol mixes are frequently used. For other coolant types, please contact Mikros Technologies for thermal performance estimates.
Pressure Drop (psi)

0

10

Results

W/cm²
Average Heat Flux
C
Reduction in Junction Temperature
(compared to 250um finned cold plate at the same flow rate)
°C
Increase in Inlet Temperature
(compared to 250um finned cold plate at the same flow rate)
°C
Junction to Case Temperature Increase
(fixed value, based on input Junction to Case Thermal Resistivity)
°C
Temperature Increase Across Thermal Interface Material (TIM)
(fixed value, based on input Junction to Case Thermal Resistivity)
°C
Maximum Junction Temperature