Data Centers
Advancements in Data Center Cooling
The shift from air cooling to liquid cooling marks a significant advancement in data center efficiency. While traditional air-cooled systems fail to keep pace with chips now exceeding multiple kilowatts of waste heat per device, liquid cooling is proven to remove more than 5x more heat per unit area by comparison. Liquid cooling enables hyperscalers and data center providers to deploy higher-density racks, reduce downtime, and meet growing compute demands without increasing energy consumption.
Why Liquid Cooling Matters
Liquid cooling significantly enhances HPC and AI performance and reliability by delivering superior heat dissipation compared to traditional air cooling. As AI workloads grow denser and more power-intensive, especially in hyperscale data centers, liquid cooling enables processors to maintain optimal operating temperatures while reducing power consumption and maximizing data center footprint utilization. It also provides scalability for future high-density deployments, enabling more compute and acceleration within the same footprint without compromising performance or efficiency.
Liquid cooling enables server densities up to 2–3× greater than air cooling, effectively managing the heat generated by high-performance components. Direct-to-chip (D2C) microchannel cold plates can cool components such as CPUs, GPUs, and ASICs with excess thermal margin, keeping chips under their maximum junction temperatures even at multi-kilowatt thermal design powers (TDPs).
Well-designed liquid cooling technology prevents thermal throttling, a CPU and GPU safety feature that reduces power to avoid overheating but also reduces valuable compute performance. Our patented cold plate microchannel architectures can achieve thermal resistances as low as 0.02°C·cm²/W, 5–10x lower than industry standards. This enables processors to operate at higher speeds for extended periods, thereby increasing compute power, reducing component failures, and extending the lifespan of hardware.
Our cooling designs are adaptable to the full range and combination of CPUs, GPUs, ASICs, memory modules, transceivers, and power electronics. Whether the design components include multi-kW ASICs, DIMM modules, or the latest pluggable transceivers, Mikros Technologies meets complete system requirements with precision-engineered designs.
Liquid cooling of servers can dramatically reduce energy consumption compared to legacy air cooling. Because liquids have a much higher heat capacity than air, they can absorb and transport significantly more heat per unit volume. Water’s superior thermal conductivity enables far greater heat removal from hot components for the same energy input—cutting cooling OpEx while improving system reliability. Furthermore, the more effective the direct-to-chip cold plate, the larger the “thermal budget,” which can be reinvested into system enhancements and cost savings. Our cold plates deliver industry-leading thermal performance, enabling compute providers to maximize efficiency and scalability within the same footprint.
Our innovative liquid cooling designs enable systems to operate with hotter inlet coolant temperatures and lower coolant flow rates than equivalent systems, significantly reducing energy use and operational costs associated with chilling and pumping liquids.
Sustainability in data centers is essential for minimizing their environmental impact while ensuring fast, reliable, and secure data processing and storage. Designing with liquid cooling solutions, such as those from Mikros Technologies, not only helps the planet but also aligns with growing industry and regulatory demands for environmental responsibility and operational efficiency.
Instead of dissipating excess heat into the atmosphere, some regions incentivize the transfer of processor waste heat to other commercial uses, such as heating buildings and powering industrial processes. The highly effective heat transfer of Mikros Technologies cold plates enables more efficient heat reuse by delivering more power and higher temperatures per unit coolant flow compared to equivalent systems.
Liquid cooling enables server densities up to 2–3× greater than air cooling, effectively managing the heat generated by high-performance components. Direct-to-chip (D2C) microchannel cold plates can cool components such as CPUs, GPUs, and ASICs with excess thermal margin, keeping chips under their maximum junction temperatures even at multi-kilowatt thermal design powers (TDPs).
Well-designed liquid cooling technology prevents thermal throttling, a CPU and GPU safety feature that reduces power to avoid overheating but also reduces valuable compute performance. Our patented cold plate microchannel architectures can achieve thermal resistances as low as 0.02°C·cm²/W, 5–10x lower than industry standards. This enables processors to operate at higher speeds for extended periods, thereby increasing compute power, reducing component failures, and extending the lifespan of hardware.
Our cooling designs are adaptable to the full range and combination of CPUs, GPUs, ASICs, memory modules, transceivers, and power electronics. Whether the design components include multi-kW ASICs, DIMM modules, or the latest pluggable transceivers, Mikros Technologies meets complete system requirements with precision-engineered designs.
Liquid cooling of servers can dramatically reduce energy consumption compared to legacy air cooling. Because liquids have a much higher heat capacity than air, they can absorb and transport significantly more heat per unit volume. Water’s superior thermal conductivity enables far greater heat removal from hot components for the same energy input—cutting cooling OpEx while improving system reliability. Furthermore, the more effective the direct-to-chip cold plate, the larger the “thermal budget,” which can be reinvested into system enhancements and cost savings. Our cold plates deliver industry-leading thermal performance, enabling compute providers to maximize efficiency and scalability within the same footprint.
Our innovative liquid cooling designs enable systems to operate with hotter inlet coolant temperatures and lower coolant flow rates than equivalent systems, significantly reducing energy use and operational costs associated with chilling and pumping liquids.
Sustainability in data centers is essential for minimizing their environmental impact while ensuring fast, reliable, and secure data processing and storage. Designing with liquid cooling solutions, such as those from Mikros Technologies, not only helps the planet but also aligns with growing industry and regulatory demands for environmental responsibility and operational efficiency.
Instead of dissipating excess heat into the atmosphere, some regions incentivize the transfer of processor waste heat to other commercial uses, such as heating buildings and powering industrial processes. The highly effective heat transfer of Mikros Technologies cold plates enables more efficient heat reuse by delivering more power and higher temperatures per unit coolant flow compared to equivalent systems.
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