Power Electronics
Liquid Cooling for Power Electronics
Power electronics systems are essential for efficient energy conversion across a wide range of applications, including renewable energy, electric vehicle (EV) charging, motor control, and industrial power supplies. Insulated-gate bipolar transistors (IGBTs), increasingly enhanced by advanced materials such as silicon carbide (SiC) and gallium nitride (GaN), offer superior efficiency and high-speed switching capabilities. However, these components generate substantial heat, and conventional air-cooling methods are no longer sufficient to meet the thermal demands of modern high-frequency, high-power systems.
In this demanding environment, power electronics must prioritize both efficiency and resilience. Mikros Technologies’ innovative liquid cooling solutions deliver unparalleled thermal management, ensuring your devices operate cooler, longer, and more reliably. Whether you are powering data storage, precision power supplies, or autonomous systems, our solutions effectively reduce thermal stress, minimize downtime, and maximize performance and system lifetime. We deliver ultra-low thermal resistance and rapid transient response, empowering designers to push performance boundaries and guarantee long-term system reliability.
Why Liquid Cooling Matters
Advanced liquid cooling is essential for power electronics, offering superior thermal management in high-performance systems where air cooling is insufficient. As power densities increase in devices such as inverters, converters, and motor drives, excessive heat can severely degrade performance, shorten lifespan, and lead to failures. Mikros Technologies' liquid cooling solutions excel at heat transfer capacity, ensuring optimal operating temperatures and enabling more compact, reliable, and energy-efficient designs. Our best-in-class technology is critical in applications where thermal constraints directly impact system performance, safety, and longevity.
Our thermal management systems are engineered to maintain stable junction temperatures, significantly reducing thermal cycling stresses such as wire bond delamination and solder fatigue. This thermal consistency minimizes mechanical strain on critical components, resulting in longer device lifespans, fewer maintenance cycles, and improved operational uptime. We achieve industry-leading thermal performance with thermal resistance values while maintaining pressure drops of 5-35 kPa (1-5 psi), enabling efficient cooling with minimal pumping power. By mitigating temperature-induced failure mechanisms, our solutions deliver safer and more reliable performance in demanding environments, ultimately lowering the total cost of ownership and enhancing system-level efficiency.
High-voltage direct current (HVDC) architectures are emerging as a transformative data center power distribution approach, with hyperscale operators actively testing implementations and broad adoption projected by 2027. Operating around 800 V DC voltages significantly reduces transmission losses and improves efficiency, but introduces new thermal management challenges. In particular, bus bars carrying such high currents will likely require advanced liquid cooling solutions to maintain safe operating temperatures and ensure reliability under these demanding conditions.
Compared to air-cooling systems, which typically dissipate only 1–2 kW and exhibit high thermal resistance, our Mikromatrix™ liquid cooling architectures offer a significant performance advantage with thermal resistances several factors lower than finned and jet impingement liquid cooling methods. This enhanced heat transfer capability enables higher power densities and sustained operation under elevated thermal loads, thereby maximizing system performance and reliability.
Engineers can achieve compact, high-density designs with our Mikromatrix™ technology. This technology enables significantly greater power per unit volume, allowing for reduced system footprints and enhanced energy efficiency. This makes our solutions exceptionally well-suited for space-constrained applications such as EV chargers, aerospace systems, and industrial power electronics.
Mikros Technologies offers a high degree of customization. Our designs can be engineered to match the thermal and mechanical specifications of individual IGBT modules, chip geometries, and application-specific constraints. Our advanced manufacturing capabilities enable precise thermal management solutions for prototype development or full-scale production. This tailored approach ensures optimal heat dissipation, improved reliability, and enhanced performance across diverse power electronics platforms.
As a Jabil company, Mikros Technologies offers customers advantages such as rapid prototyping, dependable global supply chains, and a smooth transition to high-volume production. By manufacturing on a global scale, we guarantee consistent quality, scalability, and speed, providing solutions that meet the demands of dynamic markets and accelerate product development cycles.
Our thermal management systems are engineered to maintain stable junction temperatures, significantly reducing thermal cycling stresses such as wire bond delamination and solder fatigue. This thermal consistency minimizes mechanical strain on critical components, resulting in longer device lifespans, fewer maintenance cycles, and improved operational uptime. We achieve industry-leading thermal performance with thermal resistance values while maintaining pressure drops of 5-35 kPa (1-5 psi), enabling efficient cooling with minimal pumping power. By mitigating temperature-induced failure mechanisms, our solutions deliver safer and more reliable performance in demanding environments, ultimately lowering the total cost of ownership and enhancing system-level efficiency.
High-voltage direct current (HVDC) architectures are emerging as a transformative data center power distribution approach, with hyperscale operators actively testing implementations and broad adoption projected by 2027. Operating around 800 V DC voltages significantly reduces transmission losses and improves efficiency, but introduces new thermal management challenges. In particular, bus bars carrying such high currents will likely require advanced liquid cooling solutions to maintain safe operating temperatures and ensure reliability under these demanding conditions.
Compared to air-cooling systems, which typically dissipate only 1–2 kW and exhibit high thermal resistance, our Mikromatrix™ liquid cooling architectures offer a significant performance advantage with thermal resistances several factors lower than finned and jet impingement liquid cooling methods. This enhanced heat transfer capability enables higher power densities and sustained operation under elevated thermal loads, thereby maximizing system performance and reliability.
Engineers can achieve compact, high-density designs with our Mikromatrix™ technology. This technology enables significantly greater power per unit volume, allowing for reduced system footprints and enhanced energy efficiency. This makes our solutions exceptionally well-suited for space-constrained applications such as EV chargers, aerospace systems, and industrial power electronics.
Mikros Technologies offers a high degree of customization. Our designs can be engineered to match the thermal and mechanical specifications of individual IGBT modules, chip geometries, and application-specific constraints. Our advanced manufacturing capabilities enable precise thermal management solutions for prototype development or full-scale production. This tailored approach ensures optimal heat dissipation, improved reliability, and enhanced performance across diverse power electronics platforms.
As a Jabil company, Mikros Technologies offers customers advantages such as rapid prototyping, dependable global supply chains, and a smooth transition to high-volume production. By manufacturing on a global scale, we guarantee consistent quality, scalability, and speed, providing solutions that meet the demands of dynamic markets and accelerate product development cycles.
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