Networking & Communications
Cooling Solutions for Next-Generation Data Transmission: Core and Edge Management
As the demand for high-speed connectivity continues to rise, driven by advancements in AI, streaming services, cloud computing, and the global expansion of 5G, networking infrastructure is becoming increasingly compute-dense and thermally constrained. Modern network systems, which include hyperscale switch fabrics, edge routers, transceivers, and software-defined networking (SDN) controllers, require reliable, compact, and energy-efficient cooling solutions.
Mikros Technologies delivers superior liquid cooling solutions that effectively tackle thermal management challenges across the entire networking stack. Our solutions significantly enhance density, uptime, and efficiency at both the core and edge of the network, ensuring optimal performance.
Redesigning your network for performance, density, and efficiency?
Liquid cooling is essential for modern networking and communications systems, as traditional air cooling cannot effectively manage the heat generated by high-density, high-power equipment. Mikros Technologies offers liquid cooling solutions for complex, multi-component networking systems. Our innovative liquid-cooling designs feature compact, efficient microchannel flow regimes that cool network and communication equipment, seamlessly integrating into space-constrained racks and field deployments.
#1
High-SpeedFaster speeds are essential for enabling quicker data transfers, reducing latency, and effectively supporting the growing number of connected devices and online services. Increased speed not only enhances user competitiveness but also minimizes wasted time. High-speed switches, routers, and transceivers generate intense, localized heat. A liquid-cooling solution ensures stable performance during high network traffic, preventing instability and thermal throttling that reduce clock speed and risk damage.
Mikros Technologies’ cold plates are precision-tuned for high-performance hardware, including application-specific integrated circuits (ASICs), demand-side platforms (DSPs), and optical modules, supporting sustained throughput with thermal stability.
#2
Reliable PerformanceNetworking and communication equipment must function consistently and reliably to ensure continuous uptime and service delivery. Mikros Technologies offers direct liquid cooling technology that meets the demands of the latest switchgear and processors. Our rugged cold plates perform reliably in both data center racks and edge locations, even under environmental extremes. With proper coolant care, they provide long-lasting, low-maintenance performance, making them ideal for telecommunications edge and internet service provider (ISP) field deployments.
#3
Energy EfficiencyTo effectively manage heat, air cooling systems primarily rely on powerful fans and computer room air conditioning (CRAC) units. However, these systems consume substantial energy, resulting in higher operational costs. In contrast, the coolants utilized in liquid cooling technology have a much higher heat capacity than air, allowing them to transfer heat up to 25 times more effectively. This capacity enables liquids to absorb and dissipate heat more quickly and efficiently than air-cooling.
Additionally, Mikros Technologies' designs incorporate low-pressure drop, reducing the energy required for pumping liquids and allowing the loop to operate at higher temperatures. These innovations improve power usage effectiveness (PUE) and significantly reduce overall operational expenses (OpEx). Lower energy consumption reduces a carbon footprint, helping organizations meet environmental goals.
#4
Higher-Density SystemsAir cooling struggles to prevent hotspots as rack power density increases, while liquid-cooling systems allow servers and networking gear to be packed more densely into racks. Because liquid cooling is more targeted and efficient, it eliminates the need for wide aisles and complex airflow management. Mikros Technologies' liquid cooling designs enhance heat transfer effectiveness, enabling warmer inlet coolant temperatures in high-density racks.
#5
Adaptable DesignsOur advanced liquid cooling solutions are expertly engineered to excel in removing high heat flux power (W/cm2) across a wide range of hardware setups. The growth of 5G and edge services is driving the expansion of computing capabilities into remote, unconditioned environments, such as cell towers, access cabinets, and field nodes. Liquid cooling offers quiet, sealed thermal solutions where fans and airflow are impractical or unreliable. ISPs and telecommunications (telco) companies are increasing rack density in colocation and regional data centers. Liquid cooling allows for higher compute and switching density while reducing retrofit costs.
#1
High-SpeedFaster speeds are essential for enabling quicker data transfers, reducing latency, and effectively supporting the growing number of connected devices and online services. Increased speed not only enhances user competitiveness but also minimizes wasted time. High-speed switches, routers, and transceivers generate intense, localized heat. A liquid-cooling solution ensures stable performance during high network traffic, preventing instability and thermal throttling that reduce clock speed and risk damage.
Mikros Technologies’ cold plates are precision-tuned for high-performance hardware, including application-specific integrated circuits (ASICs), demand-side platforms (DSPs), and optical modules, supporting sustained throughput with thermal stability.
#2
Reliable PerformanceNetworking and communication equipment must function consistently and reliably to ensure continuous uptime and service delivery. Mikros Technologies offers direct liquid cooling technology that meets the demands of the latest switchgear and processors. Our rugged cold plates perform reliably in both data center racks and edge locations, even under environmental extremes. With proper coolant care, they provide long-lasting, low-maintenance performance, making them ideal for telecommunications edge and internet service provider (ISP) field deployments.
#3
Energy EfficiencyTo effectively manage heat, air cooling systems primarily rely on powerful fans and computer room air conditioning (CRAC) units. However, these systems consume substantial energy, resulting in higher operational costs. In contrast, the coolants utilized in liquid cooling technology have a much higher heat capacity than air, allowing them to transfer heat up to 25 times more effectively. This capacity enables liquids to absorb and dissipate heat more quickly and efficiently than air-cooling.
Additionally, Mikros Technologies' designs incorporate low-pressure drop, reducing the energy required for pumping liquids and allowing the loop to operate at higher temperatures. These innovations improve power usage effectiveness (PUE) and significantly reduce overall operational expenses (OpEx). Lower energy consumption reduces a carbon footprint, helping organizations meet environmental goals.
#4
Higher-Density SystemsAir cooling struggles to prevent hotspots as rack power density increases, while liquid-cooling systems allow servers and networking gear to be packed more densely into racks. Because liquid cooling is more targeted and efficient, it eliminates the need for wide aisles and complex airflow management. Mikros Technologies' liquid cooling designs enhance heat transfer effectiveness, enabling warmer inlet coolant temperatures in high-density racks.
#5
Adaptable DesignsOur advanced liquid cooling solutions are expertly engineered to excel in removing high heat flux power (W/cm2) across a wide range of hardware setups. The growth of 5G and edge services is driving the expansion of computing capabilities into remote, unconditioned environments, such as cell towers, access cabinets, and field nodes. Liquid cooling offers quiet, sealed thermal solutions where fans and airflow are impractical or unreliable. ISPs and telecommunications (telco) companies are increasing rack density in colocation and regional data centers. Liquid cooling allows for higher compute and switching density while reducing retrofit costs.
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